| 描述 | 標準 | 進階 |
|---|---|---|
| Structure | 3+n+3 (9+N+9 MAX) | 10+N+10 |
| Layer Count | 2~42L | 50L |
| Min. Board thickness | 0.005" (+/-10%) | 0.005" (+/-10%) |
| Max. Board thickness | 0.250" (+/-10%) | 0.280" (+/-8%) |
| BGA Pitch | 8mils (0.2mm) | 6mils (0.15mm) |
| Min.BGA pad/space | 7mils/3mils | 5mils/2mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Prepreg (FR4 1067/1086/2113) | Yes | Yes |
| Prepreg (ceramics Ro4350) | Yes | Yes |
| Laser Drillable Prepreg | Yes | Yes |
| laser Drillable core (FR4, PI, PTFE, ceramics) | Yes | Yes |
| laser Drillable Min.Dielectric thickness | 1.5mils | 1.2mils |
| laser Drillable Max.Dielectric thickness | 5mils | 6mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Min / Max | 2.5mils / 6mils | 2mils / 8mils |
| Min via edge to via dege space | 5mils | 4mils |
| True position Tolerance | +/-1mils | +/-1mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Min. Drilled blind via diameter (as drilled) | 6mils | 4mils |
| Min via edge to via dege space (as drilled) | 8mils | 6mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Blind via aspect ratio (dielectric thickness/ Laser drill hole size) | 0.8 | 1 |
| Blind via plating thickness | 0.3~1mils | 0.3~1mils |
| Capture pad A/R | 2mils | 1.5mils |
| Laser via Fill Material | Epoxy resin/Copper paste | Epoxy resin/Copper paste |
| Blind via aspect ratio (as drilled) (dielectric thickness/ drilling hole size) | 0.5 | 0.5 |
| Blind via plating thickness (as drilled) | 0.8mils | 1.0mils |
| Capture pad A/R (as drilled) | 3mils | 2mils |