Rigid

Inner Layer

Description	Production	Advanced
Min.Trace/Space	1.5mils / 1.5mils	1.2mils / 1.5mils
Min. Copper Thickness	1/3oz	1/7 oz
Max. Copper Thickness	10oz	12oz
Min. Core Thickness	1.5mils	1.2mils
Line/ pad to drill hole	5mils	3mils
Line/ pad to board edge	8mils	6mils
Line Tolerance	+/-10%	+/-8%

Board Dimensions

Description	Production	Advanced
Max. Finish Board Size	19”X26”	20”X28”
min. Finish Board Size	0.2"x0.2"	0.15"*0.15"
Max. Board Thickness	0.260"(+/-10%)	0.280"(+/-8%)
Min. Board Thickness	0.007"(+/-10%)	0.005"(+/-10%)

Lamination

Description	Production	Advanced
Layer Count	50L	60L
Layer to Layer Registration	+/-4mils	+/-2mils

Drilling

Description	Production	Advanced
Min. Drill Size	6mils	5mils
Min. Hole to Hole Pitch	16mils(0.4mm)	14mils(0.35mm)
True position Tolerance	+/-3mils	+/-2mils
Slot Diameter Tolerance	+/-3mils	+/-2mils
Min gap from PTH to track inner layers	5mils	3mils
Min. PTH edge to PTH edge space	8mils	6mils

Plating

Description	Production	Advanced
Max. Aspect Ratio	30:1	35:1
Cu Thickness in Through hole	0.8-1.5 mils	2 oz
Plated hole size tolerance	+/-2mils	+/-1.5mils
NPTH hole tolerance	+/-2mils	+/-1mils
Min. Via in pad Fill hole size	6mils	4mils
Via in pad Fill Material	Epoxy resin/Copper paste	Epoxy resin/Copper paste

Outer Layer

Description	Production	Advanced
Min. Trace/Space	2mils / 2mils	1.5mils / 1.5mils
Min. pad over drill size	6mils	4mils
Max. Copper thickness	12 oz	18 oz
Line/ pad to board edge	8mils	6mils
Line Tolerance	+/-15%	+/-8%

Metal Finish

Description	Production	Advanced
HASL	50-1000u”	50-1000u”
HASL+Selective Hard gold	Yes	Yes
OSP	8-20u”	8-20u”
Selective ENIG+OSP	Yes	Yes
ENIG(Nickel/Gold)	80-200u”/2-9 u”	250u”/ 10u”
Immersion Silver	6-18u”	6-18u”
Hard Gold for Tab	10-80u”	10-80u”
Immersion Tin	30u”min.	30u” min.
ENEPIG (Ni/Pd/Au)	125u"/4u"/1u” min.	150u"/8u"/2u” min.
Soft Gold (Nickel/ Gold)	200u”/ 20u”min.	200u”/ 20u”

Solder Mask

Description	Production	Advanced
S/M Thickness	0.4mils min.	2mils max.
Solder dam width	4mils	3mils
S/M registration tolerance	+/-1.5mils	+/-1mils
S/M over line	3.5mils	2mils / 2mils

Legend

Description	Production	Advanced
Min. Space to SMD pad	6mils	4mils
Min. Stroke Width	6mils	5mils
Min. Space to Copper pad	6mils	4mils
Standard Color	White or Yellow	N/A

Electrical Testing

Description	Production	Advanced
Max. Test Points	30000 Points	30000 Points
Smallest SMT Pitch	16mils(0.4mm)	12mils(0.3mm)
Smallest BGA Pitch	10mils(0.25mm)	6mils(0.15mm)

NC Rout

Description	Production	Advanced
Min. Rout to copper space	8mils	4mils
Rout tolerance	+/-4mils	+/-3mils

Scoring (V-cut)

Description	Production	Advanced
Conductor to center line	15mils	15mils
X&Y Position Tolerance	+/-4mils	+/-3mils
Score Anger	30o/45o	30o/45o
Score Web	10mils min.	8mils min.

Beveling

Description	Production	Advanced
bevel anger	20-71o	20-71o
Bevel Dimensional Tolerance	+/-10mils	+/-10mils

Impedance controll

Description	Production	Advanced
Impedance controll	+/-5%	+/-5%